- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups
Patent holdings for IPC class H01L 21/50
Total number of patents in this class: 2107
10-year publication summary
164
|
136
|
101
|
106
|
107
|
124
|
136
|
123
|
105
|
39
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
137 |
STATS ChipPAC Pte. Lte. | 1516 |
97 |
Texas Instruments Incorporated | 19376 |
82 |
Intel Corporation | 45621 |
69 |
Micron Technology, Inc. | 24960 |
69 |
Infineon Technologies AG | 8189 |
62 |
Samsung Electronics Co., Ltd. | 131630 |
49 |
Advanced Semiconductor Engineering, Inc. | 1546 |
46 |
International Business Machines Corporation | 60644 |
34 |
Renesas Electronics Corporation | 6305 |
31 |
Mitsubishi Electric Corporation | 43934 |
22 |
Semiconductor Components Industries, L.L.C. | 5345 |
22 |
Jcet Semiconductor (shaoxing) Co., Ltd. | 366 |
20 |
Texas Instruments Japan, Ltd. | 1656 |
18 |
Shinko Electric Industries Co., Ltd. | 1186 |
18 |
Shenzhen Xinguodu Technology Co., Ltd. | 2467 |
18 |
Kioxia Corporation | 9847 |
17 |
Applied Materials, Inc. | 16587 |
16 |
Siliconware Precision Industries Co., Ltd. | 489 |
16 |
Huawei Technologies Co., Ltd. | 100781 |
14 |
Other owners | 1250 |